Thin film packaging structure and display panel

ABSTRACT

This disclosure relates to the field of display technologies and, in particular to a thin film packaging structure and a display panel. A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic adjusting layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic adjusting layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on, claims the benefit of, and claims priorityto Chinese Patent Application No. 201910812392.4, filed on Aug. 30,2019, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

This disclosure relates to the field of display technologies and, inparticular, to a thin film packaging structure and a display panel.

BACKGROUND

With the continued expansion of the application field of flexibleorganic light-emitting diode (OLED) display panels, there are increasedreliability requirements of flexible OLED devices in severeenvironments.

At present, in order to prevent water and oxygen from getting into OLEDdevices, thin film packaging technologies are usually applied to performpackaging. A traditional thin film packaging structure includesinorganic layers and organic layers that are successively stacked. Theinorganic layer of thin film packaging structure experiences greaterstresses when it is bended, so that the inorganic layer may be easilybroken. Alternatively, film layers of the thin film packaging structuremay be easily separated, reducing the bendability of the display panel.

It should be noted that the information disclosed in the above“Background” section is merely intended to reinforce understanding ofthe background technology of the present disclosure and, accordingly,the Background may include information that does not constitute theprior art as already known by an ordinary person skilled in the art.

BRIEF SUMMARY

An objective of this disclosure is to provide a thin film packagingstructure and a display panel, which have good bending performance.

A first aspect of the present disclosure provides a thin film packagingstructure, which includes: a first inorganic packaging layer forcovering a device to be packaged; an organic packaging layer formed at aside of the first inorganic packaging layer; a second inorganicpackaging layer formed at a side of the organic packaging layer facingaway from the first inorganic packaging layer; and at least one firstinorganic adjusting layer formed at a side of the first inorganicpackaging layer facing away from the device to be packaged. The firstinorganic adjusting layer has an elasticity modulus greater than that offirst inorganic packaging layer and the second inorganic packaginglayer.

In one exemplary embodiment of the present disclosure, one of the atleast one first inorganic adjusting layer is formed between the firstinorganic packaging layer and the organic packaging layer.

In one exemplary embodiment of the present disclosure, one of the atleast one first inorganic adjusting layer is formed between the organicpackaging layer and the second inorganic packaging layer.

In one exemplary embodiment of the present disclosure, a thickness ofthe first inorganic adjusting layer between the second inorganicpackaging layer and the organic packaging layer is less than a thicknessof the first inorganic adjusting layer between the first inorganicpackaging layer and the organic packaging layer.

In one exemplary embodiment of the present disclosure, a thickness ofthe first inorganic adjusting layer between the first inorganicpackaging layer and the organic packaging layer is less than a thicknessof the first inorganic adjusting layer between the second inorganicpackaging layer and the organic packaging layer.

In one exemplary embodiment of the present disclosure, one of the atleast one first inorganic adjusting layer is formed at a side of thesecond inorganic packaging layer facing away from the organic packaginglayer.

In one exemplary embodiment of the present disclosure, one of the atleast one first inorganic adjusting layer is formed at a side of thefirst inorganic packaging layer facing towards the device to bepackaged.

In one exemplary embodiment of the present disclosure, the thin filmpackaging structure further includes: a second inorganic adjusting layerformed at a side of the first inorganic packaging layer facing towardsthe device to be packaged; wherein a refractive index of the secondinorganic adjusting layer is lower than a refractive index of the firstinorganic packaging layer.

In one exemplary embodiment of the present disclosure, the secondinorganic adjusting layer is made of lithium fluoride.

In one exemplary embodiment of the present disclosure, the firstinorganic adjusting layer is made of silicon oxide.

In one exemplary embodiment of the present disclosure, the silicon oxidehas a thickness of 10 nm to 100 nm.

A second aspect of the present disclosure provides a display panel,which includes: a device to be packaged; and the thin film packagingstructure of any one of the above embodiments.

According to a thin film packaging structure and a display panel, afirst inorganic adjusting layer having a greater elasticity modulus at aside of the first inorganic packaging layer facing away from the deviceto be packaged, increasing the stability of the thin film packagingstructure in the process of bending to avoid the thin film packagingstructure from being broken, or prevent separation between film layers,ensuring the packaging stability of the film packaging structure, andthereby improving the bending performance and service life of thedisplay panel.

It should be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate embodiments consistent with thepresent disclosure and together with the description, serve to explainthe principles of the present disclosure. It should be apparent that thedrawings in the following description are merely examples of thisdisclosure, and that other drawings may also be obtained by thoseordinary skilled in the art without creative work.

FIGS. 1-16 respectively show schematic views of thin film packagingstructures according to different embodiments of the present disclosure.

DETAILED DESCRIPTION

Now, the exemplary embodiments will be described more fully withreference to the accompanying drawings. However, the exemplaryembodiments can be embodied in a variety of forms and should not beconstrued as limiting the embodiments set forth herein. Instead, theseembodiments are provided so that the present disclosure will be thoroughand complete, and the concepts of the exemplary embodiments will befully given to those skilled in the art. The same reference numeralsdenote the same or similar structures in the drawings, and thus theirdetailed descriptions will be omitted. In addition, the drawings aremerely schematic illustrations of the present disclosure, and are notnecessarily drawn to scale.

Although relative terms such as “above” and “under” are used herein todescribe the relationship of one component relative to anothercomponent, such terms are used herein only for the sake of convenience,for example, in the direction shown in the figure, it should beunderstood that if the referenced device is inversed upside down, acomponent described as “above” will become a component described as“under.” When a structure is described as “above” another structure, itprobably means that the structure is integrally formed on anotherstructure, or, the structure is “directly” disposed on anotherstructure, or, the structure is “indirectly” disposed on anotherstructure through an additional structure.

An embodiment of the present disclosure provides a thin film packagingstructure, which has certain bendability. Specifically, as shown inFIGS. 1-16 , the thin film packaging structure may include a firstinorganic packaging layer 10, an organic packaging layer 11, a secondinorganic packaging layer 12, and at least one first inorganic adjustinglayer 13.

The first inorganic packaging layer 10 is used to cover a device to bepackaged, where the device to be packaged may be an OLED device. That isto say, the OLED device may be packaged using the thin film packagingstructure. The OLED device is packaged by the first inorganic packaginglayer 10 to prevent water and oxygen from getting into the OLED deviceand thus, ensure the service life of the OLED device.

For example, the first inorganic packaging layer 10 may be made ofsilicon oxynitride. The silicon oxynitride may be deposited on a surfaceof the device to be packaged through the chemical vapor deposition (CVD)method to package the device.

The organic packaging layer 11 may be formed at a side of the firstinorganic packaging layer 10. The organic packaging layer 11 isprovided, on one hand, to improve flatness of the thin film packagingstructure and, on the other hand, to improve the bending capability ofthe entire thin film packaging structure. For example, the organicpackaging layer 11 may be an inkjet printing layer formed by inkjetprinting with an organic liquid. The second inorganic packaging layer 12may be formed at a side of the organic packaging layer 11 facing awayfrom the first inorganic packaging layer 10. The second inorganicpackaging layer 12 is provided to further improve the packaging effectof the thin film packaging structure. For example, the second inorganicpackaging layer 12 may be made of silicon nitride. The silicon nitridemay be deposited on the organic packaging layer 11 by chemical vapordeposition.

The first inorganic adjusting layer 13 may be formed at a side of thefirst inorganic packaging layer 10 facing away from the device to bepackaged. An elasticity modulus of the first inorganic adjusting layer13 is greater than elasticity modulus of the first inorganic packaginglayer 10 or the second inorganic packaging layer 12. In this embodiment,a first inorganic adjusting layer 13 having a greater elasticity modulusis provided at the side of the first inorganic packaging layer 10 facingaway from the device to be packaged to increase the stability of thethin film packaging structure in a bending process to avoid the thinfilm packaging structure from being broken, or prevent separationbetween film layers, thereby ensuring the packaging stability of thefilm packaging structure, and thereby improving the bending performanceand service life of the display panel.

The thickness of the first inorganic adjusting layer 13 may be 10 nm to100 nm, for example, 10 nm, 30 nm, 50 nm, 70 nm, 90 nm, 100 nm, etc.,that is, the thickness of the first inorganic adjusting layer 13 may bebetween 10 nm and 100 nm. In this embodiment, the thickness of the firstinorganic adjusting layer 13 is designed to be between 10 nm and 100 nm,on one hand, to avoid the situation that the first inorganic adjustinglayer 13 is too thin to adjust the position of the stress neutral layer,on the other hand, to avoid the situation that the first inorganicadjusting layer 13 is too thick and thus leading to lower light-emittingefficiency of the thin film package structure.

For example, the first inorganic adjusting layer 13 may be made ofsilicon oxide. The silicon oxide may be deposited at a side of the firstinorganic packaging layer 10 by chemical vapor deposition, and thesilicon oxide has characteristics of high elasticity modulus, hightransmission rate, and the like, so that the transmission rate of thethin film packaging structure may be improved while the structuralstability of the thin film packaging structure is improved. In addition,since the thickness of the silicon oxide is easy to be controlled,silicon oxide is used as the first inorganic adjusting layer 13, and thethickness of the first inorganic adjusting layer 13 may be adjustedaccording to practical problems that occur in the bending process of thethin film packaging structure, so that the stress neutral layer at thebending position is closer to the inorganic packaging layer which iseasy to be broken or separated.

It should be noted that, this embodiment may adjust the thickness of thefirst inorganic adjusting layer 13 according to the practical problemsthat occur in the bending process of the thin film packaging structureso that the stress neutral layer at the bending position may be closerto the inorganic packaging layer which is easy to be broken orseparated. Also, the positional relationships between the firstinorganic adjusting layer 13 and the first inorganic packaging layer 10and the second inorganic packaging layer 12 may be adjusted according tothe practical problems that occur in the bending process of the thinfilm packaging structure, so that the stress neutral layer at thebending position may be closer to the inorganic packaging layer which iseasy to be broken or separated.

The structure of the thin film packaging structure will be described indetail below with reference to the accompanying drawings.

In an embodiment of the present disclosure, if the first inorganicpackaging layer 10 of the thin film packaging structure is more easilybroken or separated from other film layers during the actual bendingprocess of the display panel, as shown in FIG. 1 , the first inorganicadjusting layer 13 may be formed between the first inorganic packaginglayer 10 and the organic packaging layer 11, so that the stress neutrallayer at the bending position may be offset towards the first inorganicpackaging layer 10, that is, the distance between the first inorganicpackaging layer 10 and the stress neutral layer is reduced, as such,compared to the solution that the first inorganic packaging layer 10 isdirectly combined with the organic packaging layer 11 in the prior art,the deformation amount of the first inorganic packaging layer 10 may bereduced as reaching the same bending radius, to alleviate the situationthat the first inorganic packaging layer 10 may be broken or separatedfrom other film layers in the bending process, and further ensure thestability of the thin film packaging structure, so that the packagingeffect of the thin film packaging structure can be improved.

It should be noted that, when the first inorganic adjusting layer 13 ismade of silicon oxide, and the first inorganic packaging layer 10 ismade of silicon oxynitride, an oxygen content of the first inorganicadjusting layer 13 is greater than an oxygen content of the firstinorganic packaging layer 10, so that a contact angle between the firstinorganic adjusting layer 13 and the organic packaging layer 11 issmaller than a contact angle between the first inorganic packaging layer10 and the organic packaging layer 11. Therefore, after curing, abonding strength between the first inorganic adjusting layer 13 and theorganic packaging layer 11 is greater than a bonding strength betweenthe first inorganic packaging layer 10 and the organic packaging layer11.

In this embodiment, compared with the situation that the first inorganicpackaging layer 10 is directly combined with the organic packaging layer11, the first inorganic adjusting layer 13 is formed between the firstinorganic packaging layer 10 and the organic packaging layer 11 toincrease the combination stability between the first inorganic packaginglayer 10 and the organic packaging layer 11, and avoid the interlayerseparation between the first inorganic packaging layer 10 and theorganic packaging layer 11, thereby ensuring the stability of the thinfilm packaging structure and improving the packaging effect of the thinfilm packaging structure.

In an embodiment of the present disclosure, when the first inorganicadjusting layer 13 is made of silicon oxide, and the second inorganicpackaging layer 12 is made of silicon nitride, the oxygen content of thefirst inorganic adjusting layer 13 is greater than the oxygen content ofthe second inorganic packaging layer 12 so that the contact anglebetween the first inorganic adjusting layer 13 and the organic packaginglayer 11 is smaller than the contact angle between the second inorganicpackaging layer 12 and the organic packaging layer 11. After curing, thebonding strength between the first inorganic adjusting layer 13 and theorganic packaging layer 11 may be greater than the bonding strengthbetween the second inorganic packaging layer 12 and the organicpackaging layer 11.

As shown in FIG. 2 , relative to the previous embodiment, apart fromthat the first inorganic adjusting layer 13 is formed between the firstinorganic packaging layer 10 and the organic packaging layer 11, thefirst inorganic adjusting layer 13 may also be formed between the secondinorganic packaging layer 12 and the organic packaging layer 11, incomparison with the direct combination between the second inorganicpackaging layer 12 and the organic packaging layer 11, the combinationstability between the second inorganic packaging layer 12 and theorganic packaging layer 11 may be increased, and the interlayerseparation between the second inorganic packaging layer 12 and theorganic packaging layer 11 may be avoided, so that the stability of thethin film packaging structure may be ensured, and the packaging effectof the thin film packaging structure may be improved.

It should be noted that, in the actual bending process, if the stressneutral layer is at a side of the first inorganic packaging layer 10 orthe second inorganic packaging layer 12, the stress neutral layer may befurther offset towards the first inorganic packaging layer 10 or thesecond inorganic packaging layer 12 as described in this embodiment, toreduce the distance between the first or second inorganic packaginglayer 10 or 12 and the stress neutral layer, and reduce the deformationamount of the first inorganic packaging layer 10 and/or the secondinorganic packaging layer 12, thereby alleviating the situation that thefirst inorganic packaging layer 10 and/or the second inorganic packaginglayer 12 are/is broken or separated from other film layers in thebending process, and further ensuring the stability of the thin filmpackaging structure, such that the packaging effect of the thin filmpackaging structure can be improved.

It should be noted that the thickness of the first inorganic adjustinglayer 13 between the second inorganic packaging layer 12 and the organicpackaging layer 11 may be smaller than the thickness of the firstinorganic adjusting layer 13 between the first inorganic packaging layer10 and the organic packaging layer 11, but is not limited thereto, andmay be greater than or equal to the thickness of the first inorganicadjusting layer 13 between the first inorganic packaging layer 10 andthe organic packaging layer 11 according to the specific situations.

In an embodiment of the present disclosure, if the second inorganicpackaging layer 12 of the thin film packaging structure is more likelyto be broken or separated from other film layers during the actualbending process of the display panel, the first inorganic adjustinglayer 13 may be formed between the second inorganic packaging layer 12and the organic packaging layer 11, as shown in FIG. 3 ; or the firstinorganic adjusting layer 13 is formed at a side of the second inorganicpackaging layer 12 facing away from the organic packaging layer 11, asshown in FIG. 4 ; or a first inorganic adjusting layer 13 is formedbetween the second inorganic packaging layer 12 and the organicpackaging layer 11, and another first inorganic adjusting layer 13 isformed at a side of the second inorganic packaging layer 12 facing awayfrom the organic packaging layer 11, as shown in FIG. 5 . With thesesolutions, the stress neutral layer at the bending position may beoffset towards the second inorganic packaging layer 12, i.e., thedistance between the second inorganic packaging layer 12 and the stressneutral layer may be reduced, so that compared to the traditional mannerthat the second inorganic packaging layer 12 is directly combined withthe organic packaging layer 11, the deformation amount of the secondinorganic packaging layer 12 may be reduced when the bending radius isconsistent, alleviating the situation that the first inorganic packaginglayer 10 may be broken or separated from other film layers in thebending process, and then ensuring the stability of the thin filmpackaging structure, so that the packaging effect of the thin filmpackaging structure may be improved.

It should be noted that, when the first inorganic adjusting layer 13 ismade of silicon oxide and the second inorganic packaging layer 12 ismade of silicon nitride, the oxygen content of the first inorganicadjusting layer 13 is greater than the oxygen content of the secondinorganic packaging layer 12, so that the contact angle between thefirst inorganic adjusting layer 13 and the organic packaging layer 11 issmaller than the contact angle between the second inorganic packaginglayer 12 and the organic packaging layer 11. Therefore, after curing,the bonding strength between the first inorganic adjusting layer 13 andthe organic packaging layer 11 is greater than the bonding strengthbetween the second inorganic packaging layer 12 and the organicpackaging layer 11.

In the embodiment, preferably, the first inorganic adjusting layer 13 isformed between the second inorganic packaging layer 12 and the organicpackaging layer 11, and compared to the situation that the secondinorganic packaging layer 12 is directly combined with the organicpackaging layer 11, the combination stability between the secondinorganic packaging layer 12 and the organic packaging layer 11 may befurther increased, and the interlayer separation between the secondinorganic packaging layer 12 and the organic packaging layer 11 may beavoided, thereby ensuring the stability of the thin film packagingstructure, and improving the packaging effect of the thin film packagingstructure.

In an embodiment of the present disclosure, when the first inorganicadjusting layer 13 is made of silicon oxide, and the first inorganicpackaging layer 10 is made of silicon oxynitride, the oxygen content ofthe first inorganic adjusting layer 13 is greater than the oxygencontent of the first inorganic packaging layer 10, so that the contactangle between the first inorganic adjusting layer 13 and the organicpackaging layer 11 is smaller than the contact angle between the firstinorganic packaging layer 10 and the organic packaging layer 11. Aftercuring, the bonding strength between the first inorganic adjusting layer13 and the organic packaging layer 11 is greater than the bondingstrength between the first inorganic packaging layer 10 and the organicpackaging layer 11.

As shown in FIGS. 6 to 8 , compared to the previous embodiment (seeFIGS. 3 to 5 ), in addition to forming the first inorganic adjustinglayer 13 between the second inorganic packaging layer 12 and the organicpackaging layer 11, and/or in addition to forming the first inorganicadjusting layer 13 at a side of the second inorganic packaging layer 12facing away from the organic packaging layer 11, a first inorganicadjusting layer 13 may also be formed between the first inorganicpackaging layer 10 and the organic packaging layer 11, which mayincrease the combination stability between the first inorganic packaginglayer 10 and the organic packaging layer 11, and may prevent the firstinorganic packaging layer 10 and the organic packaging layer 11 frombeing separated from each other, thereby ensuring the stability of thethin film packaging structure and improving the packaging effect of thethin film packaging structure, compared to the situation that the firstinorganic packaging layer 10 is directly combined with the organicpackaging layer 11 in the prior art.

It should be noted that, in the actual bending process, if the stressneutral layer is at a side of the first inorganic packaging layer 10 orthe second inorganic packaging layer 12, the stress neutral layer ofthis embodiment may be further offset towards the first inorganicpackaging layer 10 or the second inorganic packaging layer 12, so as toreduce the distance between the first inorganic packaging layer 10 orthe second inorganic packaging layer 12 and the stress neutral layer,reduce the deformation amount of the first inorganic packaging layer 10and the second inorganic packaging layer 12, and alleviate the situationthat the first inorganic packaging layer 10 or the second inorganicpackaging layer 12 is broken or separated from other film layers in thebending process, thereby ensuring the stability of the thin filmpackaging structure, and improving the packaging effect of the thin filmpackaging structure.

It should be noted that, the thickness of the first inorganic adjustinglayer 13 between the first inorganic packaging layer 10 and the organicpackaging layer 11 may be smaller than the thickness of the firstinorganic adjusting layer 13 between the second inorganic packaginglayer 12 and the organic packaging layer 11, but is not limited thereto,and may be greater than or equal to the thickness of the first inorganicadjusting layer 13 between the second inorganic packaging layer 12 andthe organic packaging layer 11 according to the specific situations.

In an embodiment of the present disclosure, as shown in FIGS. 9-16 , themain difference from any of the previous embodiments is that, a firstinorganic adjusting layer 13 is also provided at a side of the firstinorganic packaging layer 10 facing towards the device to be packaged.The first inorganic adjusting layer 13 is provided so that the stressneutral layer may be offset towards the first inorganic packaging layer10, or may be offset towards the first inorganic packaging layer 10 andthe second inorganic packaging layer 12 at the same time, depending onan initial position of the stress neutral layer, so as to alleviate thesituation that the first inorganic packaging layer 10 and the secondinorganic packaging layer 12 are broken or separated from other filmlayers during the bending process, and ensure the stability of the thinfilm packaging structure, and improve the packaging effect of the thinfilm packaging structure.

In addition, the first inorganic adjusting layer 13 of the embodiment ismade of silicon oxide, which does not absorb water and has a goodcapability of blocking water and oxygen, so as to further prevent waterand oxygen from getting into the device to be packaged, therebyimproving the reliability of the product. Also, the silicon oxide haslower refractive index, and the light extraction efficiency is notinfluenced.

Alternatively, as shown in FIGS. 9-16 , the main difference from any ofthe previous embodiments (see FIGS. 1 to 8 ) is that, a second inorganicadjusting layer 14 is provided at a side of the first inorganicpackaging layer 10 facing towards the device to be packaged. Therefractive index of the second inorganic adjusting layer 14 is lowerthan the refractive index of the first inorganic packaging layer 10, andalternatively, the second inorganic adjusting layer 14 may be made oflithium fluoride.

When the thin film packaging structure of the embodiment is applied topackage a display device, the light emitting efficiency of the displaypanel may be improved.

It should be noted that the first inorganic adjusting layer 13 of any ofthe above embodiments is not limited to silicon oxide, but may also besilicon oxynitride, as long as the oxygen content of the first inorganicadjusting layer 13 is greater than that of the first inorganic packaginglayer 10 to achieve characteristics of high elasticity modulus and highbonding strength.

A second aspect of the present disclosure provides a display panel,which can be applied to display devices such as mobile phones andcomputers. The display panel may include a device to be packaged (notshown in the figures) and a thin film packaging structure for packagingthe device to be packaged, where the device to be packaged may be anOLED display device, and the thin film packaging structure may be a thinfilm packaging structure described in any of the above embodiments, anddetails will not be repeated here. The display panel of the presentembodiment may be a flexible display panel.

The terms “a,” “an,” “the,” “said,” and “at least one” are used toexpress the presence of one or more the element, component, or the like.The terms “comprise,” “include,” and “have” are intended to beinclusive, and mean there may be additional elements, components, or thelike other than the listed elements, components, or the like. The terms“first” and “second” are used only as labels, and are not numericalrestriction to the objects.

Other embodiments of the disclosure will be apparent to those skilled inthe art from consideration of the specification and practice of thedisclosure disclosed herein. This application is intended to cover anyvariations, uses, or adaptations of the disclosure following, ingeneral, the principles of the disclosure and including such departuresfrom the present disclosure as come within known or customary practicein the art to which the disclosure pertains. It is intended that thespecification and examples be considered as exemplary only, with a truescope and spirit of the disclosure being indicated by the followingclaims.

What is claimed is:
 1. A thin film packaging structure, comprising: afirst inorganic packaging layer for covering a device to be packaged; anorganic packaging layer formed at a side of the first inorganicpackaging layer; a second inorganic packaging layer formed at a side ofthe organic packaging layer facing away from the first inorganicpackaging layer; and at least one first inorganic adjusting layer formedat a side of the first inorganic packaging layer facing away from thedevice to be packaged, the at least one first inorganic adjusting layerhaving an elasticity modulus greater than that of the first inorganicpackaging layer and the second inorganic packaging layer, wherein the atleast one first inorganic adjusting layer is a plurality of firstinorganic adjusting layers, and one of the first inorganic adjustinglayers is formed between the first inorganic packaging layer and theorganic packaging layer.
 2. The thin film packaging structure of claim1, wherein one of the first inorganic adjusting layers is formed betweenthe organic packaging layer and the second inorganic packaging layer. 3.The thin film packaging structure of claim 2, wherein a thickness of theone of the first inorganic adjusting layers between the second inorganicpackaging layer and the organic packaging layer is less than a thicknessof the one of the first inorganic adjusting layers between the firstinorganic packaging layer and the organic packaging layer.
 4. The thinfilm packaging structure of claim 2, wherein the one of the firstinorganic adjusting layers is formed at a side of the second inorganicpackaging layer facing away from the organic packaging layer.
 5. Thethin film packaging structure of claim 1, wherein the one of the firstinorganic adjusting layers is formed at a side of the first inorganicpackaging layer facing towards the device to be packaged.
 6. A thin filmpackaging structure, comprising: a first inorganic packaging layer forcovering a device to be packaged; an organic packaging layer formed at aside of the first inorganic packaging layer; a second inorganicpackaging layer formed at a side of the organic packaging layer facingaway from the first inorganic packaging layer; and at least one firstinorganic adjusting layer formed at a side of the first inorganicpackaging layer facing away from the device to be packaged, the at leastone first inorganic adjusting layer having an elasticity modulus greaterthan that of the first inorganic packaging layer and the secondinorganic packaging layer, wherein the at least one first inorganicadjusting layer is a plurality of first inorganic adjusting layers, andone of first inorganic adjusting layers is formed between the organicpackaging layer and the second inorganic packaging layer.
 7. The thinfilm packaging structure of claim 6, wherein one of the first inorganicadjusting layers is formed between the first inorganic packaging layerand the organic packaging layer.
 8. The thin film packaging structure ofclaim 7, wherein a thickness of the one of the first inorganic adjustinglayers between the first inorganic packaging layer and the organicpackaging layer is less than a thickness of the one of the firstinorganic adjusting layers between the second inorganic packaging layerand the organic packaging layer.
 9. A thin film packaging structure,comprising: a first inorganic packaging layer for covering a device tobe packaged; an organic packaging layer formed at a side of the firstinorganic packaging layer; a second inorganic packaging layer formed ata side of the organic packaging layer facing away from the firstinorganic packaging layer; and at least one first inorganic adjustinglayer formed at a side of the first inorganic packaging layer facingaway from the device to be packaged, the at least one first inorganicadjusting layer having an oxygen content greater than that of the firstinorganic packaging layer and/or the second inorganic packaging layer,wherein the at least one first inorganic adjusting layer comprises twofirst inorganic adjusting layers, one of the two first inorganicadjusting layers is between the first inorganic packaging layer and theorganic packaging layer, and the other of the two first inorganicadjusting layers is between the second inorganic packaging layer and theorganic packaging layer.
 10. The thin film packaging structure of claim9, wherein an oxygen content of the first inorganic adjusting layerbetween the first inorganic packaging layer and the organic packaginglayer is greater than that of the first inorganic packaging layer; andan oxygen content of the first inorganic adjusting layer between thesecond inorganic packaging layer and the organic packaging layer isgreater than that of the second inorganic packaging layer.
 11. The thinfilm packaging structure of claim 9, wherein a thickness of the firstinorganic adjusting layer between the first inorganic packaging layerand the organic packaging layer is greater than that of the firstinorganic adjusting layer between the second inorganic packaging layerand the organic packaging layer.
 12. The thin film packaging structureof claim 9, wherein a material of the first inorganic adjusting layerbetween the first inorganic packaging layer and the organic packaginglayer is same as that of the first inorganic packaging layer.
 13. Thethin film packaging structure of claim 9, wherein a material of thefirst inorganic adjusting layer between the second inorganic packaginglayer and the organic packaging layer is different from that of thesecond inorganic packaging layer.
 14. The thin film packaging structureof claim 9, wherein a material of the first inorganic packaging layercomprises silicon oxynitride.
 15. The thin film packaging structure ofclaim 9, wherein a material of the second inorganic packaging layercomprises silicon nitride.
 16. The thin film packaging structure ofclaim 9, wherein a material of the first inorganic adjusting layerbetween the second inorganic packaging layer and the organic packaginglayer comprises silicon oxide.
 17. The thin film packaging structure ofclaim 9, wherein a material of the first inorganic adjusting layerbetween the first inorganic packaging layer and the organic packaginglayer comprises silicon oxynitride.
 18. A display panel comprising thethin film packaging structure of claim 9 and the device to be packaged.19. The display panel of claim 18, wherein the device to be packagedcomprises an organic light emitting diode device.